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Laser Marking Machine|Trust Laser

激光打标机

Semiconductor side pump laser marking machine

From:www.trslaser.com.cn Author:Anna Views :
It is a breakthrough change in the field of laser marking. This laser have low energy consumption, high electro-optical conversion efficiency, stable laser output mode, high reliability, small size, good marking effect, no supplies and other significant
  
Semiconductor side-pumped laser marking machine is the use of galvanometer laser marking technology and the most advanced semiconductor pump laser technology, america imported semiconductor array,a wavelength of 808nm semiconductor laser diode-pumped Nd: YAG crystal,let YAG rod make a lot of reverse particles, wavelength of 1064 nm giant pulse laser beam output under the action of Q switch. The laser beam passes through the beam expander, focusing, and finally realize the marking controlling the deflection of galvanometer. It is a breakthrough change in the field of laser marking. This laser have low energy consumption, high electro-optical conversion efficiency, stable laser output mode, high reliability, small size, good marking effect, no supplies and other significant advantages. Important optical components are imported from Europe and America, optical system fully sealed structure, with optical path preview and focus indicator, for a long time (24 hours) work to provide a reliable guarantee for the machine.
 


Samples show


 




Technical characteristics

  • Good stability :
Using semiconductor technology to replace conventional electric vacuum technology. High-power semiconductor matrix, greatly extending the life of the product and the stability of the system.
  • High precision :
The output beam quality more nearly ideal model,and more suitable for ultra-fine processing, minimum character size up to 0.2mm, the accuracy of the laser marker to a new orders of magnitude.
  • Fast :
Ultra-fine optical device, the galvanometer faster than traditional laser systems.
  • Low energy consumption :
Efficient semiconductor matrix, the laser conversion efficiency greatly improved.
  • High reliability :
System is highly integrated, and no high voltage power supply, high voltage devices, greatly ensure system reliability.
  • Small :
Highly integrated control systems, will help customers make better use of factory space.

 


Field of application

It can be carved metal and nonmetal materials. More suitable for requiring finer, more accurate place.
Used in electronic components, integrated circuits (IC), electrical appliances, mobile communications, hardware, tools, accessories, precision instruments, eyeglasses and clocks, jewelry, auto parts, plastic buttons, construction material, PVC pipe, medical equipment and other industries.
Suitable materials include: ordinary metals and alloys (iron, copper, aluminum, magnesium, zinc and all other metals), rare metals and alloys (gold, silver, titanium), metal oxides (various metal oxides), a special surface treatment (phosphide, aluminum anodizing, plating surface), ABS material (shell appliances, daily necessities), ink (translucent keys, printing products), epoxy resin (packaging, insulation layer of electronic components).
 



Product parameters

Project name Technical parameters

Model

CX-DP50 / 75

Laser output power

50W / 75W

Laser wavelength

1064nm

Beam quality (㎡)

<6

Laser repetition rate

≤50KHz

Standard engraving area

110mmX110mm

Optional engraving area

70mmX70mm / 100mmX100mm

150mmX150mm (optional) 

Engraving depth

0.50mm / 0.75mm

Total power

1.5KW

Minimum line width

0.015mm

Repeatability

±0.0025mm

Carving line speed

≤7000mm/s

Host size (L × W × H)

Host system : 880 × 850 × 1200mm
 
Cooling system : 720x440x720mm

Cooling system

The High Precision APC ± 0.1 / cycle chiller


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