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Semiconductor side pumped laser marking machine

The semiconductor pump series laser marking machine uses galvanometer laser marking technology and the most advanced semiconductor pump laser technology in the world. It adopts a semiconductor array imported from the United States CEO and pumps Nd: YAG crystals with a semiconductor laser diode with a wavelength of 808nm. The YAG rod generates a large number of inverted particles, and forms a giant pulse laser beam with a wavelength of 1064 nm under the action of the Q switch. The laser beam is expanded and focused, and finally the mark is controlled by controlling the deflection of the galvanometer.

  • Description
  • The semiconductor pump series laser marking machine uses galvanometer laser marking technology and the most advanced semiconductor pump laser technology in the world. It adopts a semiconductor array imported from the United States CEO and pumps Nd: YAG crystals with a semiconductor laser diode with a wavelength of 808nm. The YAG rod generates a large number of inverted particles, and forms a giant pulse laser beam with a wavelength of 1064 nm under the action of the Q switch. The laser beam is expanded and focused, and finally the mark is controlled by controlling the deflection of the galvanometer. It is a breakthrough revolution in the field of laser marking. This type of laser has the significant advantages of low energy consumption, high electro-optical conversion efficiency, good laser output mode stability, high reliability, small size, good marking effect, and no consumables. The whole machine adopts an integrated design in accordance with ergonomic principles, with beautiful appearance and convenient operation. Important optical components are imported from Europe and the United States. The optical path system uses a fully sealed structure, with optical path preview and focus indication functions, which provides a reliable guarantee for the machine to work continuously for 24 hours.
     
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    Technical characteristics

    Good stability
    Semiconductor pumped laser marking systems use semiconductor technology to replace traditional electric vacuum technology. The excitation source uses a high-power semiconductor matrix, which greatly extends the life of the product and the stability of the system.

    High precision
    The quality of the output beam of the semiconductor pumped laser marking system is closer to the ideal mode, which is more suitable for ultra-fine processing. The minimum character size can reach 0.2mm, which makes the laser marking accuracy reach a new order of magnitude.

    high speed
    The semiconductor pumped laser marking system uses ultra-fine optics, and its galvanometer speed is much higher than that of traditional laser systems.

    Low energy consumption
    The semiconductor laser marking system uses a high-efficiency semiconductor matrix, which greatly improves the laser conversion efficiency.

    High reliability
    The semiconductor laser marking system has a high degree of system integration, does not require high-voltage power supplies and high-voltage components, and greatly ensures system reliability.

    Small and high
    The highly integrated control system helps customers make better use of the factory space.

    Application area
    Can be engraved metal and a variety of non-metallic materials. It is more suitable for applications that require more precise and higher precision.
    Used in electronic components, integrated circuits (IC), electrical appliances, mobile phone communications, hardware products, tool accessories, precision equipment, glasses and watches, jewelry, auto parts, plastic keys, building materials, PVC pipes, medical equipment and other industries.
    Applicable materials include: ordinary metals and alloys (iron, copper, aluminum, magnesium, zinc and all metals), rare metals and alloys (gold, silver, titanium), metal oxides (all kinds of metal oxides can be used), special surfaces Treatment (phosphating, aluminum anodizing, electroplated surface), ABS material (appliances of electrical appliances, daily necessities), ink (light-transmissive keys, printed products), epoxy resin (electronic component packaging, insulation layer).

    Product parameters
    project name Technical Parameters
    Model CX-DP50/75
    Laser output power 50W/75W
    Laser wavelength 1064nm
    Beam qualitym2 <6
    Laser repetition frequency ≤50KHz
    Standard engraving range 110mmX110mm
    Optional carving range 70mmX70mm/100mmX100mm
    150mmX150mm(可选)
    Carving depth 0.50mm/0.75mm
    Total power 1.5KW
    Minimum line width 0.015mm
    Repeat accuracy ±0.0025mm
    Carving line speed ≤7000mm/s
    Host size(L×W×H) Host system:880×850×1200mm
    cooling system:720x440x720mm
    cooling system High-precision constant temperature ± 0.1 / circulating chiller
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